White Paper: Platform Root of Trust Application on Intel Server
The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...
This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging solutions for server products.
Molded pulp, made from paper, is biodegradable and serves as an effective alternative to traditional plastic packaging such as EPE foam, reducing environmental impact. The material offers strong structural support, verified through vibration, drop testing, and finite element analysis to ensure safety during transportation.
Looking ahead, Wiwynn aims to enhance the water resistance of molded pulp and streamline production costs. The company also foresees the continuous evolution of molded pulp packaging, with innovations in material composition and design that will further contribute to sustainable packaging solutions for server products.
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The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...
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