<img height="1" width="1" style="display:none;" alt="" src="https://px.ads.linkedin.com/collect/?pid=2569132&amp;fmt=gif">
Skip to the main content.
Sustainable Supply Chain
Innovation with Green Technology
Eco-Friendly Operation
Driven People with Shared Beliefs

1 min read

High Performance/Scalability Compute Accelerator with Latest PCIe Gen4 Technology

High Performance/Scalability Compute Accelerator with Latest PCIe Gen4 Technology

The fast development of AI deep learning and HPC applications increases demands for high performance and high scalability computing solutions to accelerate model training and data processing. To address the fast-growing market, Wiwynn unveiled the industry’s first PCIe Gen 4 enabled 4U disaggregated compute accelerator—XC200G2 at OCP US Summit 2018.

XC200G2 is a 19” 4U JBOG (Just a bunch of GPUs) supporting up to sixteen PCIe x16 accelerator cards, including GPUs, ASICs, and FPGA cards. Data centers can choose among various solutions to accelerate and optimize their workloads.

With Broadcom’s industry first PCIe Gen4 switch, the bandwidth is double the traditional PCIe Gen3 to provide high performance computing capability. XC200G2’s breakthrough air cooling and mechanical designs, on the other hand, sets the best performance free from thermal barriers.

In this whitepaper, we will detail the innovative designs and the performance test to help potential adopters understand how XC200G2 can assist data centers to optimize their workloads with remarkable performance, scalability and quality.

Leave your contact information to download the whitepaper.

White Paper: Platform Root of Trust Application on Intel Server

White Paper: Platform Root of Trust Application on Intel Server

The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...

Read More
White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power

1 min read

White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power

As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...

Read More
White Paper: A Holistic Approach to Managing Liquid-Cooled AI Clusters

White Paper: A Holistic Approach to Managing Liquid-Cooled AI Clusters

The integration of advanced liquid cooling systems in AI clusters is essential for maintaining thermal stability and optimizing performance. Key...

Read More