White Paper: Platform Root of Trust Application on Intel Server
The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...
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White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power
As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...
White Paper: A Holistic Approach to Managing Liquid-Cooled AI Clusters
The integration of advanced liquid cooling systems in AI clusters is essential for maintaining thermal stability and optimizing performance. Key...
White Paper: Innovation Molded Pulp Packaging for Server Products
This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging...
White Paper: Anti-tilt Mechanism for Bare Die CPU
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...
White Paper: How to Optimize PCB finished in-board Trace Width to meet Impedance Requirement
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system...
White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
Traditional approaches, such as Trace Mapping FEA, often encounter significant challenges due to uncertainties in material properties and high...
White Paper: Scalability and Flow Distribution of Immersion Cooling Tank
With the rapid growth of immersion cooling, Wiwynn has developed a 1-Phase Immersion Tank to meet the rising power demands of emerging technologies...
White Paper: The Practice of the Wiwynn Management Device
The whitepaper thoroughly discusses the benefits of the Wiwynn Management Device across various critical usage scenarios in liquid-cooled...