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SV302G3

High density 1U2Node server with versatile system configurations for compute intensive workloads

 

Features

SV302G3_CPU2

 

Optimized System Architecture for Compute Intensive Workloads

Wiwynn SV302G3 system is a 1U server platform that is capable of configuring with one or dual nodes with dual socket CPU within each node. It features Intel® Xeon® Scalable Processors and the 2nd Generation Intel® Xeon® Scalable Processors. The latter provides pervasive performance enhancement including higher per- core performance and CPU frequency

Enhanced Memory and Optimized Thermal Solution

For memory capacity, it is designed with 16 DIMM slots per node; DDR4 up to 2933MT/s and 64Gb -based DDR4 DIMMs, system memory capacity up to 1TB. As a high density 1U2Node chassis, SV302G3 offers an optimized thermal solution for balancing cooling and power efficiency.

SV302G3_memory_thermal2

Painless Upgrade for Machine Learning

The new feature of Intel® Deep Learning Boost (VNNI) empowers Wiwynn SV302G3 to deliver significant and more efficient AI inference acceleration without hardware changes. With support of Intel® Optane™ DC persistent memory (AEP), data centers can utilize up to 512GB per DIMM for in-memory database, in-memory analytics or super-fast storage applications with affordable cost.

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SV302G3_sku-3

 

Versatile System Configurations with Universal Enclosure

Wiwynn SV302G3 offers three configurations for different workloads, which are compute intensive, I/O intensive and compute-storage balanced. System operators may agilely configure different nodes of the combination of processors, NVMe SSDs, PCIe expansions in the same enclosure depending on different applications, such as real-time analytics, AI inference, and even mission-critical tasks.

Front_4SSD-1200x106

Front Access Design to Simplify Maintenance

Easy manageability and serviceability is key factor for OPEX of cloud service providers. Compared to traditional multi-node servers, the system is front-accessible with tool-less maintenance. Rack cabling and maintenance efforts are reduced to a minimum, enabling our customers to focus more on rack configuration and deployment scalability.

Tech Spec

Node Specification
Form Factor 1U, Half Width/1U, Full Width
Processor Next Generation Intel® Xeon® Scalable Processors
Memory 16 DIMM slots; DDR4 up to 2933 MT/s
RDIMM/LRDIMM; Up to 1TB
Chipset Intel® C621 series
Security TPM 2.0
System Bus Intel® UltraPath Interconnect; 10.4GT/s
Processor Sockets 2
Storage SV302G3-C:
‧Four 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
SV302G3-I:
‧Two 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
SV302G3-S:
‧Eight 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
Expansion Slots SV302G3-C:
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
SV302G3-I:
‧One PCIe x16 FHHL slot
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
SV302G3-S:
‧One PCIe x16 FHHL slot
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
Management LAN IPMI v2.0 Compliant, iKVM, Wiwynn Cluster Manager
I/O Ports ‧One Debug Port (USB 3.0 Type A CONN)
‧One USB 3.0 Type A CONN
‧One GbE RJ45 Port
‧One OCP NIC Port
‧Power/Reset button
Chassis Specification
Dimensions 448 (W) * 790 (D) * 43.5 (H)
PSU 2 x 800W/1300W (1+1), hot-swappable
Fan 6 dual-rotor hot-plug fans for 2 zones
Weight 19.5kg/39kg

Download

Category File Title Release Date Actions
Datasheet SV302G3 2021/12/17 Download