Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system performance and reliability. In design and manufacturing processes, characteristic impedance is prominent in even the slightest variations of any factors, which can deviate the intended impedance value, potentially resulting in unforeseen effects on the product.
Wiwynn conducted a series of experiments and analyzed various factors under proper process control. Based on the experimental results, it can be observed that the lateral etching amount of traces is influenced by copper spacing and thickness.
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